NEW DELHI: Strengthening India’s efforts in attaining self-sufficiency in the critical semiconductor segment, the Union Cabinet on Tuesday approved four semiconductor projects, entailing a total investment of Rs 4,594 crore, with one of them being backed by US chipmaker Intel as well as defence and aerospace manufacturer Lockheed Martin. The projects will come up in Odisha, Punjab and Andhra Pradesh, IT & electronics minister Ashwini Vaishnaw said. The proposals were approved under the India Semiconductor Mission, which initially started the country’s semiconductor manufacturing push with an outlay of Rs 76,000 crore to provide support for those setting up chip manufacturing facilities. “This is a new industry that we have started in India, and we were able to make a breakthrough after trying for decades previously. We will build upon this,” Vaishnaw said. The Cabinet also approved US chip major Intel-backed 3D Glass semiconductor manufacturing unit in Odisha with an investment of Rs 1,943 crore. The plant will be set up by Heterogenous Integration Packaging Solutions with an annual production capacity of five crore units. Vaishnaw said the project will be backed by US firm Lockheed Martin as well.